Silicon Photonic Packaging & Process Engineer

BS or MS in Mechanical, Manufacturing, Photonics, or Electrical Engineering (or equivalent experience) 5+ years hands-on experience in semiconductor, photonics packaging, or precision opto-mechanical assembly environments Deep familiarity with automated alignment and die-attach systems Strong understanding of adhesive dispense physics and related automation equipment Proficiency with DOE methods, SPC, and Minitab (or equivalent tools) Demonstrated experience working with automation solution providers and contract manufacturers Excellent problem-solving skills and ability to collaborate across teams Willingness to travel up to 50% domestically and internationally

Own process definition and control for automated microlens alignment and bonding. Define and maintain process parameters for high-precision die-attach and placement equipment. Establish and control parameters for automated epoxy and adhesive dispense systems. Design and execute structured DOEs to characterize process sensitivity and optimize yield. Define measurement methods and run GR&R studies on critical parameters. Lead the implementation of robotics, automation, and material handling solutions. Drive failure analysis and corrective actions on process-related issues. Partner with the contract manufacturer to qualify processes, train operators, and own line readiness.