System IC Architect - Advanced Power Systems
New
N
NXPSemiconductor / Power Electronics
United States; EMEA and especially FranceFull-TimeSenior
Salary not disclosed
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Job Details
- Experience
- 15+ years of experience in power semiconductors, packaging, and system-level integration.
Requirements
- Master's degree in Power Electronics, Electrical Engineering, or related field (Ph.D. preferred).
- 15+ years of experience in power semiconductors, packaging, and system-level integration.
- Deep expertise in System-in-Package (SiP) integration.
- Experience powering high-performance compute SoC platforms.
- Strong understanding of thermal management, electrical performance, and advanced reliability.
- Proficiency in circuit simulation tools such as Cadence Spectre, PSPICE, HSPICE, Saber, or Simetrix/Simplis.
- Knowledge of PCB materials and stack-up.
- Proven track record in product definition through revenue realization.
- Ability to lead cross-functional, global teams.
- Automotive power management experience is highly valued.
- Familiarity with functional safety standards (ISO26262/IEC61508) is a plus.
- Willingness to travel globally.
Responsibilities
- Define product concepts and specifications for power semiconductor modules and System-in-Package (SiP) solutions.
- Develop and maintain long-term product and technology roadmaps in collaboration with R&D and product line leaders.
- Partner with architecture teams to ensure power solutions meet performance, efficiency, and cost targets.
- Drive early-phase engineering for AI compute and automotive power platforms.
- Analyze customer needs to deliver optimized thermal management and power efficiency strategies.
- Lead cross-functional collaboration with modeling, design, packaging, and manufacturing engineering teams.
- Act as technical liaison with customers to support co-development and design-in activities.
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