Advanced Packaging Engineer – Design & Signal Integrity
D
Delos Data IncAI data center clusters
U.S. and CanadaFull-TimeMiddle
Salary160000 - 220000 USD per year
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Job Details
- Required Skills
- PythonMatlab
Requirements
- B.S./M.S. in Electrical Engineering or related field
- Strong understanding of EM theory
- Strong understanding of transmission lines
- Strong understanding of signal integrity principles
- Expertise in SI/PI simulation tools (Keysight ADS, Ansys HFSS, Cadence Sigrity/PowerSI)
- Experience with high-speed interfaces (UCIe, D2D, Ethernet)
- Knowledge of board materials
- Knowledge of stack-up design
- Knowledge of constraint management
- Hands-on experience with lab equipment (VNA, TDR, Oscilloscope)
- Proficiency in programming/automation (Python, Matlab) is a plus
- Experience in Multi-Die package designs using standard UCIe (AP and/or SP)
- Experience selecting and managing sub-contractors
- Experience interfacing with TSMC for packaging options (bumping)
Responsibilities
- Select and design optimal multi-die IC package types considering electrical performance, cost, and manufacturability.
- Perform pre- and post-layout simulations (e.g., eye diagrams, crosstalk) for high-speed interfaces (UCIe, D2D, high-speed serdes).
- Model and simulate Power Delivery Networks (PDN) for low-voltage, high-current supplies, including AC/DC analysis and IR drop.
- Develop accurate simulation models (S-parameters, IBIS-AMI) for packages, PCBs, and sockets.
- Work with IC design, physical design, board layout, and marketing teams to define requirements and resolve issues.
- Guide PCB/package layout, reviewing stack-ups, trace routing, and component placement for optimal SI/PI performance.
- Support hardware bring-up, debug, and correlation between simulation/models and physical measurements.
- Research and implement new SI/PI techniques and tools for next-generation products.
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