Package Design Engineer
S
SPD TechnologySemiconductor packaging
Mexico. Netherlands. Germany. France. United Kingdom. IsraelFull-TimeSenior
Salary not disclosed
Apply NowOpens the employer's application page
Job Details
- Languages
- English — Upper Intermediate or higher.
- Experience
- 8 years of experience in chip package substrate design using Cadence APD or Mentor Expedition.
- Required Skills
- Scripting
Requirements
- Bachelor's degree in Mechanical Engineering, Material Engineering, Electrical Engineering, Technology, Science, a related field, or equivalent practical experience.
- 8 years of experience in chip package substrate design using Cadence APD or Mentor Expedition.
- Experience in chip package substrate layout, design verification, DFM, and taping out for production.
- Experience in design automation and scripting.
- English at Upper Intermediate level or higher.
- Bonus: Master's degree or PhD in Electrical Engineering, Computer Engineering, Computer Science, or a related field.
- Bonus: Experience working with cross-functional chip design, SI/PI, and PCB design teams.
- Bonus: Experience in 2.5D/3.5D advanced package design.
- Bonus: Experience with physical verification flows, including LVS, DRC, and connectivity.
- Bonus: Experience using CAD to create simple mechanical drawings, such as package outline drawings (POD).
- Bonus: Ability to write scripts to customize Cadence or Mentor workflows.
Responsibilities
- Develop physical package substrate designs for large-form-factor packages for ML high-performance computers.
- Develop and implement methodology and CAD flows for efficient substrate design and improved productivity.
- Manage chip-, package-, and system-level co-design initiatives and secure production sign-off for package designs.
- Collaborate with SI/PI, thermal, and mechanical engineering teams to refine product package designs, test vehicles, and mock-up designs for product feasibility.
- Define and document package substrate design requirements and the bill of materials (BOM).
- Manage package design phases including routing feasibility studies, test vehicle development, product-level designs, design reviews, artwork export, DFM activities, and final manufacturing documentation.
- Contribute to evaluation and adoption of advanced chip packaging technologies.
View Full Description & ApplyYou'll be redirected to the employer's site
